Multilayer tape including plurality of magnetic metal particles and electronic assembly including the same

ABSTRACT

A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.

BACKGROUND Technical Field

The present disclosure relates to a multilayer tape including aplurality of magnetic metal particles and an electronic assembly.

Background Art

Electromagnetic waves are normally generated in electronic products.Electromagnetic waves refer to propagation of waves in which an electricfield and a magnetic field are combined.

The electric field constituting electromagnetic waves may be easilyblocked by using a conductor. For example, the electric field may beblocked by grounding the roof, wall surface, floor, etc. of a buildingto the ground or by using a shielding material such as groundedaluminum.

However, in the case of the magnetic field constituting electromagneticwaves, a special material having high permeability should be used toblock. Such a magnetic field is harmful to human body, and may causenoises or malfunction to industrial and home devices.

Accordingly, harmfulness of electromagnetic waves is recognized and mucheffort is made in all countries of the world to prevent malfunction ofdevices caused by electromagnetic waves and to protect users fromharmful environments by setting standards of electro magneticinterference (EMI) and electro magnetic susceptibility (EMS).

SUMMARY Technical Problem

Embodiments of the present disclosure are invented in theabove-described background, and provide a multi-tape including aplurality of magnetic metal particles to have an excellentelectromagnetic wave blocking effect compared to related-art technology,and an electronic assembly.

The objects to be achieved by the present disclosure are not limited tothose mentioned above, and other objects that are not mentioned abovemay be clearly understood to those skilled in the art based on thedescription provided below.

Technical Solution

A multilayer tape according to an embodiment of the present disclosuremay include an adhesive layer including an epoxy, and an electromagneticinterference (EMI) absorption layer disposed on the adhesive layer andincluding a thermoset epoxy resin and a plurality of magnetic metalparticles which are distributed in the thermoset epoxy resin, and themagnetic metal particles may include iron, a ratio of a gross weight ofthe plurality of magnetic metal particles to a gross weight of the EMIabsorption layer may be higher than about 40%, and a peel strength ofthe adhesive layer and the EMI absorption layer after the adhesive layeris cured may be about 5 times or more greater than a peel strength ofthe adhesive layer and the EMI absorption layer before the adhesivelayer is cured.

An electronic assembly according to another embodiment of the presentdisclosure may include: a circuit board including an electro-conductivetrace and a first edge surface; an electronic element mounted on thecircuit board, electrically connected to the electro-conductive trace,and including a lateral edge spatially spaced apart from the first edgesurface; a protection layer disposed on the electronic element,substantially surrounding the electronic element, and having a planartop surface; and an electromagnetic interference (EMI) absorption layerdisposed on the protection layer through an adhesive layer, and bondedto the protection layer, and the first edge surface may connect a majortop surface and a major bottom surface of the protection layer, anaverage thickness of the protection layer may be equal to or greaterthan a height of the electronic element, the protection layer mayinclude a second edge surface connecting a major top surface and a majorbottom surface of the protection layer, the EMI absorption layer mayinclude a resin and a plurality of magnetic metal particles which aredistributed in the resin, the EMI absorption layer and the protectionlayer may include a coupled third edge surface which connects a majortop surface of the EMI absorption layer and the major bottom surface ofthe protection layer, and the first edge surface, the second edgesurface, and the third edge surface may be substantially aligned withone another, thereby forming a substantially planar coupling edgesurface.

An electronic assembly according to still another embodiment of thepresent disclosure may include: a circuit board including a plurality ofelectro-conductive traces; a plurality of spaced-apart semiconductorintegrated circuits which are mounted on the circuit board and areelectrically connected to the plurality of electro-conductive traces; aprotection layer disposed on the semiconductor integrated circuits,substantially surrounding the semiconductor integrated circuits, andhaving a planar top surface; and an EMI protection layer disposed on theprotection layer through an adhesive layer, and bonded to the protectionlayer, and the EMI protection layer may include a resin and a pluralityof magnetic metal particles which are distributed in the resin, themagnetic metal particles may include iron, silicon, and aluminum, and aratio of a gross weight of the plurality of magnetic metal particles toa gross weight of the EMI absorption layer may be higher than about 40%.

Advantageous Effects

According to embodiments of the present disclosure, there is an effectthat EMI blocking efficiency of a multilayer tape is enhanced by an EMIabsorption layer including a plurality of magnetic metal particles.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a multilayer tapeaccording to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of a semiconductor assemblyincluding the multilayer tape of FIG. 1 ;

FIG. 3 is a schematic cross-sectional view of an electronic assemblyaccording to an embodiment of the disclosure; and

FIG. 4 is a schematic cross-sectional view of an electronic assemblyaccording to another embodiment of the disclosure.

DETAILED DESCRIPTION

Advantages and features of the present disclosure, and a method forachieving the same will be clarified by referring to embodimentsdescribed in detail below along with the accompanying drawings. However,the present disclosure is not limited to the exemplary embodiments setforth herein, and may be embodied in many different forms. Rather, theexemplary embodiments are provided so that the present disclosure willbe thorough and complete, and will fully convey the scope of the presentdisclosure to those of ordinary skill in the art, and the presentdisclosure is defined by the scope of the claims.

Further, in explaining embodiments of the present disclosure, anyspecific explanation on a well-known related function or configurationdeemed to obscure the gist of the present disclosure will be omitted.Also, the terms used herein are defined according to the functions ofthe embodiments of the present disclosure. Thus, the terms may varydepending on users' or operators' intentions or practices. Therefore,the terms used herein should be understood based on the descriptionsmade herein.

FIG. 1 is a schematic cross-sectional view of a multilayer tapeaccording to an embodiment of the present disclosure.

Referring to FIG. 1 , the multilayer tape 100 may include anelectromagnetic interference (EMI) absorption layer 50 and an adhesivelayer 60. According to an embodiment, the multilayer tape 100 mayinclude various components that are not selectively mentioned. That is,the cross section of the multilayer tape 100 shown in FIG. 1 is merelyan example.

The adhesive layer 60 is configured to perform a role as an adhesive tobond the EMI absorption layer 60 and another configuration, and mayinclude an epoxy (epoxy resin). For example, the adhesive layer 60 maybond the EMI absorption layer 50 and a semiconductor wafer 80 (FIG. 2 )as shown in FIG. 2 , and the adhesive layer 60 may bond the EMIabsorption layer 50 and a protection layer 40 (FIG. 3 ) as shown in FIG.3 .

The adhesive layer 60 is cured, so that a peel strength between theadhesive layer 60 and the EMI absorption layer 50 can increase by about5 times or more compared to that before the adhesive layer 60 is cured.Alternatively, according to an embodiment, the peel strength between theadhesive layer 60 and the EMI absorption layer 50 may increase by about10 times, 20 times, or 40 times or more compared to that before theadhesive layer 60 is cured.

The EMI absorption layer 50 is configured to block electromagnetic wavesemitted from an electronic element included in an electronic assembly oremitted toward the electronic element from the outside, and the EMIabsorption layer 50 may be disposed on the adhesive layer 60.

The EMI absorption layer 50 may include a plurality of magnetic metalparticles 51 and a resin 52. To increase the EMI blocking effect, theplurality of magnetic metal particles 51 may be configured to bedistributed and positioned in places in the resin 52 included in the EMIabsorption layer 50, respectively. Herein, the resin 52 may be athermoset epoxy resin.

According to an embodiment, a ratio of a gross weight of the pluralityof magnetic metal particles 51 to a gross weight of the EMI absorptionlayer 50 may be higher than about 40%. That is, the ratio of the weightoccupied by the plurality of magnetic metal particles 51 in the EMIabsorption layer 50 may be higher than about 40%.

According to another embodiment, the ratio of the gross weight of theplurality of magnetic metal particles 51 to the gross weight of the EMIabsorption layer 50 may be higher than about 50%, may be higher thanabout 60%, or may be higher than about 80%. An average thickness t ofthe EMI absorption layer 50 may be between about 10 microns and about100 microns.

The magnetic metal particles 51 may include a material for absorbingelectromagnetic waves.

According to an embodiment, the magnetic metal particles 51 may includeiron.

According to another embodiment, the magnetic metal particles 51 mayinclude iron, silicon, and aluminum.

According to still another embodiment, the magnetic metal particles 51may include one or more of iron, nickel, chromium, zinc, magnesium,cobalt, molybdenum, vanadium, boron, and niobium.

According to yet another embodiment, the magnetic metal particles 51 mayinclude one or more of iron, nickel-zinc ferrite, magnesium-zincferrite, and iron-silicon-chromium alloy.

FIG. 2 is a schematic cross-sectional view of a semiconductor assemblyincluding the multilayer tape of FIG. 1 .

Referring to FIG. 2 , the semiconductor assembly 300 may include an EMIabsorption layer 50, an adhesive layer 60, and a semiconductor wafer 80.

The EMI absorption layer 50 shown in FIG. 2 may perform substantiallythe same function as the EMI absorption layer 50 shown in FIG. 1 .Accordingly, regarding the EMI absorption layer 50 shown in FIG. 2 ,reference is made to the descriptions of the EMI absorption layer 50shown in FIG. 1 .

In addition, regarding contents that are not contrary to the contentsdescribed through FIG. 2 in the descriptions of the adhesive layer 60shown in FIG. 1 , reference is made to the descriptions of the adhesivelayer 60 shown in FIG. 2 .

The adhesive layer 60 may be disposed between the EMI absorption layer50 and the semiconductor wafer 80 to bond the EMI absorption layer 50and the semiconductor wafer 80.

To achieve this, the adhesive layer 60 may be disposed on a majorsurface 81 of the semiconductor wafer 80 to be bonded to the majorsurface 81 of the semiconductor wafer 80.

The semiconductor wafer 80 is a circular plate that is used for makingan electronic element 30 (FIG. 3 ), and may be disposed on the adhesivelayer 60. The semiconductor wafer 80 may be bonded to the EMI absorptionlayer 50 by using the adhesive layer 60, thereby being disposed on theEMI absorption layer 50.

The semiconductor wafer 80 may include a material for forming a platewhich is used for making the electronic element 30 (FIG. 3 ). Forexample, the semiconductor wafer 80 may include one or more of silicon(Si), silicon carbide (SiC), germanium-doped silicon (SiGe), germanium(Ge), gallium arsenide (GaAs), indium phosphide (InP), gallium phosphide(GaP), gallium nitride (GaN), aluminium nitride (AlN) and indium galliumnitride (InGaN).

FIG. 3 is a schematic cross-sectional view of an electronic assemblyaccording to an embodiment of the disclosure.

Referring to FIG. 3 , the electronic assembly 200 may include a circuitboard 10, a trace 20, an electronic element 30, a protection layer 40,an EMI absorption layer 50, an adhesive layer 60, and a metal layer 90.According to an embodiment, the electronic assembly 200 may includevarious components that are not selectively mentioned. That is, thecross section of the electronic assembly 200 shown in FIG. 3 is merelyan example.

The circuit board 10 is configured to have various types of componentsmounted thereon, and may be referred to as a board 10 according to anembodiment. According to an embodiment, the circuit board 10 may includea printed circuit board, etc.

The circuit board 10 may be provided with a major top surface 12 and amajor bottom surface 13, and a first edge surface 11 as a side surfaceconnecting the same.

The trace 20 is configured to have electrical conductivity, and may bereferred to as an electro-conductive trace according to an embodiment.At least one trace 20 may be included or disposed inside the circuitboard 10 or on the surfaces 11 to 13 of the circuit board 10 describedabove. The components disposed (or mounted) in the circuit board 10 mayexchange signals with one another through the trace 20 included ordisposed in the circuit board 10.

The electronic element 30 is designed and configured to perform variousfunctions. For example, the electronic element 30 may include asemiconductor integrated circuit (semiconductor IC), or a complementarymetal-oxide semiconductor (CMOS) image sensor, etc.

The electronic element 30 may be electrically connected to the trace 20,and may be disposed (mounted) on the major top surface 12 of the circuitboard 10. The electronic element 30 may be disposed to have a spacebetween a lateral edge 31 thereof and the first edge surface 11 of thecircuit board 10, that is, to be spatially spaced apart. When aplurality of electronic elements 30 are disposed on the major topsurface 12 of the circuit board 10, the plurality of electronic elements30 may be disposed to have a space therebetween, that is, to bespatially spaced apart from one another, respectively.

When the electronic element 30 is disposed on the major top surface 12of the circuit board 10, the protection layer 40 may be disposed on theelectronic element 30 to substantially cover the electronic element 30disposed on the major top surface 12 of the circuit board 10. Herein,the protection layer 40 ‘being disposed to cover (that is, beingdisposed to encapsulate)’ the electronic element 30 implies that theprotection layer 40 is disposed to surround a part or all of the othersurfaces of the electronic element 30 except for a surface contactingthe circuit board 10.

The protection layer 40 may be provided with a major top surface 42, amajor bottom surface 43, and a second edge surface 41 as a side surfaceconnecting the same.

The major top surface 42 of the protection layer 40 may be substantiallyplanar. When the plurality of electronic elements 30 are disposed on thecircuit board 10, the heights of the respective electronic elements 30may be different from one another since types of the electronic elements30 are different. In this case, the protection layer 40 is disposed tosubstantially cover the plurality of electronic elements 30, such thatthe adhesive layer 60 is disposed on a planar surface (that is, a topsurface of the planar protection layer 40) regardless of the heights ofthe plurality of electronic elements 30.

According to an embodiment, the protection layer 40 may include an epoxymolding compound (EMC).

The adhesive layer 60 may be disposed on the protection layer 40 to bondthe protection layer 40 and the EMI absorption layer 50.

The EMI absorption layer 50 is disposed on the adhesive layer 60 and isconfigured to block electromagnetic waves emitted from the electronicelement 30 or emitted toward the electronic element 30 from the outside.

The multilayer tape 100 including the EMI absorption layer 50 and theadhesive layer 60 may be provided with a major top surface 52, a majorbottom surface 61, and a third edge surface 51 connecting the same.

Functions of the adhesive layer 60, the EMI absorption layer 50, and themultilayer tape 100 including the same are substantially the same asdescribed in FIGS. 1 and 2 , and thus descriptions thereof are omitted.

The metal layer 90 is configured to block an electric field emitted fromthe electronic element 30 or emitted toward the electronic element 30from the outside. The metal layer 90 may be disposed on the EMIabsorption layer 50, and specifically, may be disposed to cover themajor top surface 52 of the EMI absorption layer 50 and a coupling edgesurface 70.

The metal layer 90 may include a conductive ink. Herein, the conductiveink may be configured to include a plurality of materials of each of atleast one type of silver, gold, palladium, copper, indium, zinc,titanium, iron, chrome, aluminum, tin, cobalt, platinum, and nickelparticles.

Herein, the coupling edge surface 70 may refer to a virtual ‘plane’which is substantially planar and is formed by substantially aligningthe first edge surface 11 of the circuit board 10, the second edgesurface 41 of the protection layer 40, and the third edge surface 51 ofthe multilayer tape 100 including the EMI absorption layer 50 and theadhesive layer 60.

FIG. 4 is a schematic cross-sectional view of an electronic assemblyaccording to another embodiment of the present disclosure.

Referring to FIG. 4 , the electronic assembly 200 may include a circuitboard 10, a trace 20, an electronic element 30, a protection layer 40′,an adhesive layer 60, and an EMI absorption layer 50.

The circuit board 10, the trace 20, and the EMI absorption layer 50shown in FIG. 4 may perform substantially the same functions as thecircuit board 10, the trace 20, and the EMI absorption layer 50 shown inFIG. 3 . Accordingly, regarding the circuit board 10, the trace 20, andthe EMI absorption layer 50 shown in FIG. 4 , reference is made to thedescriptions of the circuit board 10, the trace 20, and the EMIabsorption layer 50 shown in FIG. 3 .

In addition, regarding contents that are not contrary to the contentsdescribed through FIG. 4 in the descriptions of the electronic element30, the protection layer 40, and the adhesive layer 60 shown in FIG. 3 ,reference is made to the descriptions of the electronic element 30, theprotection layer 40′ and the adhesive layer 60 shown in FIG. 4 .

The protection layer 40′ may be disposed on the electronic element 30 tocover at least some of the plurality of electronic elements 30. That is,the protection layer 40′ may be disposed on the electronic element 30 tocover the plurality of electronic elements 30 except for some electronicelement 30 a.

Herein, the protection layer 40″being disposed to cover (that is, beingdisposed to encapsulate) at least some electronic elements' implies thatthe protection layer 40′ is disposed not to surround at least some 32 ofthe other surfaces of one or more electronic elements 30 a of theplurality of electronic elements 30 except for a surface contacting thecircuit board 10. As can be seen through FIG. 4 , an average thicknessof the protection layer 40′ and a height of the electronic element 30 athat is highest from among the plurality of electronic elements 30 aresubstantially the same as each other, and accordingly, the protectionlayer 40′ may not be disposed to cover (to surround) the top surface 32of the electronic element 30 a. However, even in this case, the heightof the electronic element 30 a that is highest from among the pluralityof electronic elements 30 may not be higher than the average thicknessof the protection layer 40′.

The adhesive layer 60 may be attached to a top surface of the protectionlayer 40′. However, when the protection layer 40′ is not disposed tosurround the top surface 32 of the electronic element 30 a as theaverage thickness of the protection layer 40′ and the height of theelectronic element 30 a that is highest from among the plurality ofelectronic elements 30 are substantially the same as each other, theadhesive layer 60 may be attached to the top surface of the protectionlayer 40′ and the top surface 32 of the electronic element 30 a.

The following is a list of embodiments of present disclosure.

Item 1 relates to a multilayer tape including: an adhesive layerincluding an epoxy; and an electromagnetic interference (EMI) absorptionlayer disposed on the adhesive layer and including a thermoset epoxyresin and a plurality of magnetic metal particles which are distributedin the thermoset epoxy resin, wherein the magnetic metal particlesincludes iron, wherein a ratio of a gross weight of the plurality ofmagnetic metal particles to a gross weight of the EMI absorption layeris higher than about 40%, wherein a peel strength of the adhesive layerand the EMI absorption layer after the adhesive layer is cured is about5 times or more greater than a peel strength of the adhesive layer andthe EMI absorption layer before the adhesive layer is cured.

Item 2 relates to the multilayer tape, wherein the ratio of the grossweight of the plurality of magnetic metal particles to the gross weightof the EMI absorption layer is higher than about 50%.

Item 3 relates to the multilayer tape, wherein the ratio of the grossweight of the plurality of magnetic metal particles to the gross weightof the EMI absorption layer is higher than about 60%.

Item 4 relates to the multilayer tape, wherein the ratio of the grossweight of the plurality of magnetic metal particles to the gross weightof the EMI absorption layer is higher than about 80%.

Item 5 relates to the multilayer tape, wherein the peel strength of theadhesive layer and the EMI absorption layer after the adhesive layer iscured is about 10 times or more greater than the peel strength of theadhesive layer and the EMI absorption layer before the adhesive layer iscured.

Item 6 relates to the multilayer tape, wherein the peel strength of theadhesive layer and the EMI absorption layer after the adhesive layer iscured is about 20 times or more greater than the peel strength of theadhesive layer and the EMI absorption layer before the adhesive layer iscured.

Item 7 relates to the multilayer tape, wherein the magnetic metalparticles further includes silicon and aluminum.

Item 8 relates to the multilayer tape, wherein the magnetic metalparticles further include one or more of nickel, chromium, zinc,magnesium, cobalt, molybdenum, vanadium, boron, and niobium.

Item 9 relates to the multilayer tape, wherein the magnetic metalparticles further include one or more of nickel-zinc ferrite,magnesium-zinc ferrite, and iron-silicon-chromium alloy.

Item 10 relates to a semiconductor assembly including: a semiconductorwafer; and the multilayer tape disposed on a major surface of thesemiconductor wafer and bonded thereto.

Item 11 relates to the semiconductor assembly, wherein the semiconductorwafer includes one or more of silicon (Si), silicon carbide (SiC),germanium-doped silicon (SiGe), germanium (Ge), gallium arsenide (GaAs),indium phosphide (InP), gallium phosphide (GaP), gallium nitride (GaN),aluminium nitride (AlN) and indium gallium nitride (InGaN).

Item 12 relates to an electronic assembly including: a circuit boardincluding an electro-conductive trace and a first edge surface; anelectronic element mounted on the circuit board, electrically connectedto the electro-conductive trace, and including a lateral edge spatiallyspaced apart from the first edge surface; a protection layer disposed onthe electronic element, substantially surrounding the electronicelement, and having a planar top surface; and an electromagneticinterference (EMI) absorption layer disposed on the protection layerthrough an adhesive layer, and bonded to the protection layer, whereinthe first edge surface connects a major top surface and a major bottomsurface of the protection layer, wherein an average thickness of theprotection layer is equal to or greater than a height of the electronicelement, wherein the protection layer includes a second edge surfaceconnecting a major top surface and a major bottom surface of theprotection layer, wherein the EMI absorption layer includes a resin anda plurality of magnetic metal particles which are distributed in theresin, wherein the EMI absorption layer and the protection layer includea coupled third edge surface which connects a major top surface of theEMI absorption layer and the major bottom surface of the protectionlayer, wherein the first edge surface, the second edge surface, and thethird edge surface are substantially aligned with one another, therebyforming a substantially planar coupling edge surface.

Item 13 relates to the electronic assembly, wherein the electronicassembly includes a plurality of electronic elements arranged along themajor top surface of the circuit board and mounted on the circuit board,wherein the circuit board includes a plurality of electro-conductivetraces, wherein the electronic elements are electrically connected tothe electro-conductive traces, and wherein each of the electronicelements includes a lateral edge spatially spaced apart from the firstedge surface.

Item 14 relates to the electronic assembly, wherein the protection layeris disposed on each of the electronic elements, and substantiallysurrounds each of the electronic elements, and wherein the averagethickness of the protection layer is equal to or greater than heights ofthe plurality of electronic elements.

Item 15 relates to the electronic assembly, wherein a ratio of a grossweight of the plurality of magnetic metal particles to a gross weight ofthe EMI absorption layer is higher than about 40%.

Item 16 relates to the electronic assembly, wherein a ratio of a grossweight of the plurality of magnetic metal particles to a gross weight ofthe EMI absorption layer is higher than about 80%.

Item 17 relates to the electronic assembly further including a metallayer disposed on the EMI absorption layer, wherein the metal layercovers the major top surface of the EMI absorption layer and thesubstantially planar coupling edge surface.

Item 18 relates to the electronic assembly, wherein the metal layerincludes a conductive ink including a plurality of materials of each ofat least one type of silver, gold, palladium, copper, indium, zinc,titanium, iron, chrome, aluminum, tin, cobalt, platinum, and nickelparticles.

Item 19 relates to an electronic assembly including: a circuit boardincluding a plurality of electro-conductive traces; a plurality ofspaced-apart semiconductor integrated circuits which are mounted on thecircuit board and are electrically connected to the plurality ofelectro-conductive traces; a protection layer disposed on thesemiconductor integrated circuits, substantially surrounding thesemiconductor integrated circuits, and having a planar top surface; andan EMI protection layer disposed on the protection layer through anadhesive layer, and bonded to the protection layer, wherein the EMIprotection layer includes a resin and a plurality of magnetic metalparticles which are distributed in the resin, wherein the magnetic metalparticles include iron, silicon, and aluminum, wherein a ratio of agross weight of the plurality of magnetic metal particles to a grossweight of the EMI absorption layer is higher than about 40%.

Item 20 relates to the electronic assembly, wherein the ratio of thegross weight of the plurality of magnetic metal particles to the grossweight of the EMI absorption layer is higher than about 80%.

Item 21 relates to the electronic assembly, wherein electro-conductivetraces in the plurality of electro-conductive traces are electricallyisolated from one another.

Item 22 relates to the electronic assembly, wherein the semiconductorintegrated circuits are electrically connected with theelectro-conductive traces which are different from one another,respectively.

Item 23 relates to the electronic assembly, wherein at least twoelectro-conductive traces of the plurality of traces are electricallyconnected to the same semiconductor integrated circuit.

Item 24 relates to the electronic assembly, wherein the protection layerincludes an epoxy molding compound (EMC).

Item 25 relates to the electronic assembly, wherein the protection layersubstantially surrounds each semiconductor integrated circuit in theplurality of spaced-apart semiconductor integrated circuits.

Item 26 relates to the electronic assembly, wherein the protection layersubstantially encapsulates each semiconductor integrated circuit.

Item 27 relates to the electronic assembly, wherein the protection layersubstantially encapsulates each semiconductor integrated circuit, exceptfor a bottom surface of at least one semiconductor integrated circuitfacing the circuit board.

Item 28 relates to the electronic assembly, wherein the protection layerencapsulates semiconductor integrated circuits in the plurality ofspaced-apart semiconductor integrated circuit, except for a top surfaceof at least one semiconductor integrated circuit.

Item 29 relates to the electronic assembly, wherein an average thicknessof the EMI absorption layer is between about 10 microns and about 100microns.

Item 30 relates to the electronic assembly, wherein the electronicassembly includes a substantially planar edge surface which is extendedfrom a major top surface of the EMI protection layer to a major bottomsurface of the circuit board.

Item 31 relates to the electronic assembly, further including a metallayer disposed on the EMI absorption layer, wherein the metal layercovers the major top surface of the EMI absorption layer and thesubstantially planar edge surface.

Combinations of each block of the block diagram and each step of theflowchart attached to the present disclosure may be performed bycomputer program instructions. Since these computer program instructionsmay be mounted in an encoding processor of a generic-purpose computer, aspecial-purpose computer, or other programmable data processingequipment, the instructions performed through the encoding processor ofthe computer or other programmable data processing equipment generate ameans for performing the functions described at each block of the blockdiagram or each step of the flowchart. Since these computer programinstructions can be stored in a computer usable memory or a computerreadable memory which is oriented toward the computer or otherprogrammable data processing equipment to implement functions in aspecific method, the instructions stored in the computer usable memoryor the computer readable memory can produce a manufacturing itemincluding an instruction means for performing the functions described ateach block of the block diagram or each step of the flowchart. Since thecomputer program instructions can be mounted on the computer or otherprogrammable data processing equipment, a series of operation steps maybe performed on the computer or other programmable data processingequipment to generate a process executed by the computer, and theinstructions performing the computer or other programmable dataprocessing equipment can provide steps for executing the functionsdescribed at each block of the block diagram and each step of theflowchart.

In addition, each block or each step may indicate a part of a module, asegment, or a code including one or more executable instructions forexecuting specified logic function(s). In addition, it should be notedthat, in some alternative embodiments, the functions mentioned at blocksor steps may be generated in random order. For example, two blocks orsteps consecutively illustrated may be performed substantially at thesame time or the blocks or steps may be performed occasionally inreverse order according to corresponding functions.

The above-described embodiments are merely examples of the technicalconcept of the present disclosure, and various modifications and changescan be made by a person skilled in the art without departing from theessential quality of the present disclosure. Therefore, the embodimentsdisclosed in the present disclosure are not intended to limit thetechnical concept of the present disclosure, and are just to describethe technical concept of the present disclosure, and the scope of thetechnical concept of the present disclosure is not limited by theembodiments. The scope of the present disclosure should be defined bythe claims presented below, and all technical concepts within theequivalent scope thereto should be construed as being included in thescope of the present disclosure.

DESCRIPTION OF REFERENCE NUMERALS

100: multilayer tape

200: electronic assembly

300: semiconductor assembly

10: circuit board

20: trace

30: electronic element

40: protection layer

50: EMI absorption layer

60: adhesive layer

70: coupling edge surface

80: semiconductor wafer

90: metal layer

1. A multilayer tape comprising: an adhesive layer comprising an epoxy;and an electromagnetic interference (EMI) absorption layer disposed onthe adhesive layer and comprising a thermoset epoxy resin and aplurality of magnetic metal particles which are distributed in thethermoset epoxy resin, wherein the magnetic metal particles compriseiron, wherein a ratio of a gross weight of the plurality of magneticmetal particles to a gross weight of the EMI absorption layer is higherthan about 40%, wherein a peel strength of the adhesive layer and theEMI absorption layer after the adhesive layer is cured is about 5 timesor more greater than a peel strength of the adhesive layer and the EMIabsorption layer before the adhesive layer is cured.
 2. The multilayertape of claim 1, wherein the magnetic metal particles further comprisesilicon and aluminum.
 3. A semiconductor assembly comprising: asemiconductor wafer; and the multilayer tape of claim 1 disposed on amajor surface of the semiconductor wafer and bonded thereto.
 4. Anelectronic assembly comprising: a circuit board comprising anelectro-conductive trace and a first edge surface; an electronic elementmounted on the circuit board, electrically connected to theelectro-conductive trace, and comprising a lateral edge spatially spacedapart from the first edge surface; a protection layer disposed on theelectronic element, substantially surrounding the electronic element,and having a planar top surface; and an electromagnetic interference(EMI) absorption layer disposed on the protection layer through anadhesive layer, and bonded to the protection layer, wherein the firstedge surface connects a major top surface and a major bottom surface ofthe protection layer, wherein an average thickness of the protectionlayer is equal to or greater than a height of the electronic element,wherein the protection layer comprises a second edge surface connectinga major top surface and a major bottom surface of the protection layer,wherein the EMI absorption layer comprises a resin and a plurality ofmagnetic metal particles which are distributed in the resin, wherein theEMI absorption layer and the protection layer comprise a coupled thirdedge surface which connects a major top surface of the EMI absorptionlayer and the major bottom surface of the protection layer, wherein thefirst edge surface, the second edge surface, and the third edge surfaceare substantially aligned with one another, thereby forming asubstantially planar coupling edge surface.
 5. The electronic assemblyof claim 4, wherein the electronic assembly comprises a plurality ofelectronic elements arranged along the major top surface of the circuitboard and mounted on the circuit board, wherein the circuit boardcomprises a plurality of electro-conductive traces, wherein theelectronic elements are electrically connected to the electro-conductivetraces, and wherein each of the electronic elements comprises a lateraledge spatially spaced apart from the first edge surface.
 6. Theelectronic assembly of claim 5, wherein the protection layer is disposedon each of the electronic elements, and substantially surrounds each ofthe electronic elements, and wherein the average thickness of theprotection layer is equal to or greater than heights of the plurality ofelectronic elements.
 7. The electronic assembly of claim 4, furthercomprising a metal layer disposed on the EMI absorption layer, whereinthe metal layer covers the major top surface of the EMI absorption layerand the substantially planar coupling edge surface.
 8. An electronicassembly comprising: a circuit board comprising a plurality ofelectro-conductive traces; a plurality of spaced-apart semiconductorintegrated circuits which are mounted on the circuit board and areelectrically connected to the plurality of electro-conductive traces; aprotection layer disposed on the semiconductor integrated circuits,substantially surrounding the semiconductor integrated circuits, andhaving a planar top surface; and an EMI protection layer disposed on theprotection layer through an adhesive layer, and bonded to the protectionlayer, wherein the EMI protection layer comprises a resin and aplurality of magnetic metal particles which are distributed in theresin, wherein the magnetic metal particles comprise iron, silicon, andaluminum, wherein a ratio of a gross weight of the plurality of magneticmetal particles to a gross weight of the EMI absorption layer is higherthan about 40%.
 9. The electronic assembly of claim 8, wherein theprotection layer substantially surrounds each semiconductor integratedcircuit in the plurality of spaced-apart semiconductor integratedcircuits.
 10. The electronic assembly of claim 8, wherein the electronicassembly comprises a substantially planar edge surface which is extendedfrom a major top surface of the EMI protection layer to a major bottomsurface of the circuit board, and a metal layer disposed on the EMIabsorption layer, wherein the metal layer covers the major top surfaceof the EMI absorption layer and the substantially planar edge surface.11. The multilayer tape of claim 1, wherein the magnetic metal particlesfurther comprise one or more of nickel, chromium, zinc, magnesium,cobalt, molybdenum, vanadium, boron, and niobium.
 12. The multilayertape of claim 1, wherein the magnetic metal particles comprise one ormore of nickel-zinc ferrite, magnesium-zinc ferrite, andiron-silicon-chromium alloy.
 13. The electronic assembly of claim 4,wherein a ratio of a total volume of the plurality of the magnetic metalparticles to a total volume of the EMI absorbing layer is greater thanabout 40%.
 14. The electronic assembly of claim 7, wherein the firstmetal layer comprises a conductive ink comprising a plurality of atleast one of silver, gold, palladium, copper, indium, zinc, titanium,iron, chrome, aluminum, tin, cobalt, platinum, and nickel particles. 15.The electronic assembly of claim 8, wherein the electrically conductivetraces in the plurality of electrically conductive traces areelectrically isolated from each other.
 16. The electronic assembly ofclaim 8, wherein the protective layer comprises an epoxy moldingcompound (EMC).
 17. The electronic assembly of claim 8, wherein theprotective layer substantially encapsulates each semiconductorintegrated circuit.
 18. The electronic assembly of claim 8, wherein theprotective layer substantially encapsulates each semiconductorintegrated circuit except for a bottom side of at least one of thesemiconductor integrated circuit facing the circuit board.
 19. Theelectronic assembly of claim 8, wherein the protective layersubstantially encapsulates the semiconductor integrated circuits in theplurality of spaced apart semiconductor integrated circuits except for atop surface of at least one of the semiconductor integrated circuits.20. The electronic assembly of claim 8, wherein an average thickness ofthe EMI absorbing layer is between about 10 and about 100 microns.